Design of Experiments Technique for Microwave / Millimeter Wave Flip Chip Optimization

We present a design of experiments (DOE) technique for microwave/millimeter wave flip chip characterization and optimization. Two optimization approaches, signal bump misalignment and transmission line compensation, are combined together for optimal performance for high frequency operation. First, the design of experiments method is presented and its advantages are emphasized. Then, the two techniques are combined together in a factorial experiment with the purpose of optimizing the return loss to any desired frequency. The experiment is based on test structure fabrication and measurements. The one-factor-at-a-time strategy shows that return loss performance is increased with the misalignment values and decreased with compensation for the frequency range of interest. However, the statistical analysis revealed that the optimal performance is achieved for maximum compensation, and minimum misalignment. The optimal structure is measured from 1 to 75 GHz and shows return loss better than 17 dB. The method can be extended to include more optimization factors in different analysis intervals.